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Fabrication of Superhydrophobic Surfaces on Aluminum Alloy Via Electrodeposition of Copper Followed by Electrochemical Modification

Huang Ying, Sarkar Dilip K. et Chen X-Grant. (2011). Fabrication of Superhydrophobic Surfaces on Aluminum Alloy Via Electrodeposition of Copper Followed by Electrochemical Modification. Nano-Micro Letters, 3, (3), p. 160-165.

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URL officielle: http://dx.doi.org/10.3786/nml.v3i3.p160-165

Résumé

Superhydrophobic aluminum surfaces have been prepared by means of electrodeposition of copper on aluminum surfaces, followed by electrochemical modification using stearic acid organic molecules. Scanning electron microscopy (SEM) images show that the electrodeposited copper films follow "island growth mode" in the form of microdots and their number densities increase with the rise of the negative deposition potentials. At an electrodeposition potential of -0.2 V the number density of the copper microdots are found to be 4.5x10^4 cm-2 that are increased to 2.9x10^5 cm-2 at a potential of -0.8 V. Systematically, the distances between the microdots are found to be reduced from 26.6 μm to 11.03 μm with the increase of negative electrochemical potential from -0.2 V to -0.8 V. X-ray diffraction (XRD) analyses have confirmed the formation of copper stearate on the stearic acid modified copper films. The roughness of the stearic acid modified electrodeposited copper films is found to increase with the increase in the density of the copper microdots. A critical copper deposition potential of -0.6 V in conjunction with the stearic acid modification provides a surface roughness of 6.2 μm with a water contact angle of 157◦, resulting in superhydrophobic properties on the aluminum substrates­.

Type de document:Article publié dans une revue avec comité d'évaluation
Volume:3
Numéro:3
Pages:p. 160-165
Version évaluée par les pairs:Oui
Date:2011
Sujets:Sciences naturelles et génie > Génie > Génie des matériaux et génie métallurgique
Département, module, service et unité de recherche:Départements et modules > Département des sciences appliquées > Module d'ingénierie
Mots-clés:Superhydrophobic aluminum surface, water contact angle, copper microdots, surface roughness, electrochemical modification, surface de l'aluminium superhydrophobe, angle de contact de l'eau, micropoints de cuivre, rugosité de surface, modification électrochimique
Déposé le:02 sept. 2015 00:00
Dernière modification:09 déc. 2016 13:33
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