LiveZilla Live Chat Software

Constellation, le dépôt institutionnel de l'Université du Québec à Chicoutimi

Facile electrodeposition of superhydrophobic aluminum stearate thin films on copper substrates for active corrosion protection

Xu Wei, Rajan Karthikeyan, Chen X-Grant et Sarkar Dilip K.. (2019). Facile electrodeposition of superhydrophobic aluminum stearate thin films on copper substrates for active corrosion protection. Surface & Coatings Technology,

[img] PDF - Version acceptée
Administrateurs seulement jusqu´à 22 Février 2021.

1MB

URL officielle: https://doi.org/10.1016/j.surfcoat.2019.02.070

Résumé

A facile aluminum based superhydrophobic thin films were electrodeposited by mixing aluminum isopropoxide (AlOx) with stearic acid (SA) onto the copper substrates via one-step method. The energy dispersive X-ray spectroscopy (EDS)attenuated total-reflectance Fourier Transmission infrared spectroscopy (ATR-FTIR) were used to confirm the presence of Al, C, and O as well as COO-Al and C-H bonds in the thin film. The water-roll off properties were analyzed by measuring the contact angle to study the superhydrophobic nature of fabricated films. Results show that superhydrophobicity with the water contact angle of 161 ± 1° and the contact angle hysteresis of 2± 1° were obtained with respect to the AlOx/SA molar ratio of 0.33. The morphology of the fabricated thin films consisted of uniform porous structures with surface roughness (rms) of 3 m on the copper substrate. The addition of stearic acid plays an important role for the superhydrophobic property. Furthermore, the thin films and their anticorrosion behavior were investigated using 3.5 wt.% corrosive aqueous NaCl electrolyte solution. The polarization resistance of the thin film is found to be 962 kΩ·cm2 as characterized by Tafel. Similarly, impedance value of 10 MΩ·cm2 was obtained from Electrochemical Impedance Spectroscopy (EIS). A simple fabrication of water-repellent superhydrophobic aluminum-based coating endues extremely high active in corrosion protection.

Type de document:Article publié dans une revue avec comité d'évaluation
Version évaluée par les pairs:Oui
Date:22 Février 2019
Sujets:Sciences naturelles et génie > Génie > Génie des matériaux et génie métallurgique
Département, module, service et unité de recherche:Départements et modules > Département des sciences appliquées > Module d'ingénierie
Mots-clés:Copper (Cu), superhydrophobic, stearic acid, electrodeposition, anticorrosion, cuivre, superhydrophobe, électrodéposition, acide stéarique
Déposé le:13 mars 2019 01:36
Dernière modification:13 mars 2019 01:36
Afficher les statistiques de telechargements

Éditer le document (administrateurs uniquement)

Creative Commons LicenseSauf indication contraire, les documents archivés dans Constellation sont rendus disponibles selon les termes de la licence Creative Commons "Paternité, pas d'utilisation commerciale, pas de modification" 2.5 Canada.

Bibliothèque Paul-Émile-Boulet, UQAC
555, boulevard de l'Université
Chicoutimi (Québec)  CANADA G7H 2B1
418 545-5011, poste 5630