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Deicing strains and stresses of iced substrates

Laforte Caroline et Laforte Jean-Louis. (2012). Deicing strains and stresses of iced substrates. Journal of Adhesion Science and Technology, 26, (4-5), p. 603-620.

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URL officielle: http://dx.doi.org/doi:10.1163/016942411X574790

Résumé

The performance of low ice adhesion or icephobic coatings might be improved by adding a mechanical energy component via an underlying low powered electro-deformable substrate. The strain could be generated with many types of smart actuators consisting of piezoelectric devices, shape memory alloys (SMAs), conductive polymers, or ionic membrane polymer composites (IMPCs). An important step in designing a new electromechanical deicing system would consist of measuring the level of strain needed within an iced substrate to break and shed ice at the interface. In this paper are presented the results of an experimental investigation, in which new set-ups were built and used to simulate the behaviour of an active iced electromechanical substrate generating three types of strains: tensile, torsion, and bending. A total of 174 icing/deicing tests were conducted with aluminum and polyamide test specimens covered with hard rime ice deposits 2, 5 and 10 mm thick and stressed at −10°C at various strain rates in the brittle ice regime. Real time strains and forces were precisely monitored using strain gages and load cells. The stress was calculated from the deicing strain ϵ deicing and force measured at time of deicing corresponding to an interfacial failure between ice and substrate and/or cohesive failure of ice. Under test conditions used, strains were found to be very similar in torsion and in tension but about ten times lower in bending. Moreover, stresses and strains at deicing were found to increase with increasing substrate roughness and decrease with increasing ice thickness.

Type de document:Article publié dans une revue avec comité d'évaluation
Volume:26
Numéro:4-5
Pages:p. 603-620
Version évaluée par les pairs:Oui
Date:24 Juillet 2012
Sujets:Sciences naturelles et génie > Génie
Sciences naturelles et génie > Génie > Génie des matériaux et génie métallurgique
Sciences naturelles et génie > Sciences appliquées
Département, module, service et unité de recherche:Départements et modules > Département des sciences appliquées > Module d'ingénierie
Unités de recherche > Centre international de recherche sur le givrage atmosphérique et l’ingénierie des réseaux électriques (CENGIVRE) > Laboratoire international des matériaux antigivres (LIMA)
Mots-clés:Ice, Adhesion, Strain, Deicing, Electromechanical device, Glace, Adhérence, Contrainte, Dégivrage, Dispositif électromécanique
Déposé le:23 juin 2021 15:14
Dernière modification:23 juin 2021 15:14
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