Huang Xianai, Kocaefe Duygu, Boluk Yaman, Kocaefe Yasar S. et Pichette André. (2012). Effect of surface preparation on the wettability of heat-treated jack pine wood surface by different liquids. European Journal of Wood and Wood Products, 70, (5), p. 711-717.
Prévisualisation |
PDF
- Version acceptée
137kB |
Doc
- Version acceptée
248kB |
URL officielle: http://dx.doi.org/doi:10.1007/s00107-012-0605-z
Résumé
The objectives of this study are to quantitatively evaluate, using a wetting model, the wettability of three probe liquids with different properties on heat-treated jack pine surfaces prepared by three different types of machining (sanding, planing and sawing) and to compare with those of untreated wood surfaces. The results indicate that the heat-treated wood is wetted less than the untreated wood due to degradation of wood components (hemicelluloses, lignin and cellulose) during heat treatment and it absorbs less liquid. The heat-treated wood becomes most hydrophobic when wood surfaces are sanded by 180-grit paper compared to those prepared by other machining process. Heat-treated wood surfaces are strongly acidic similar to those of untreated wood. Consequently, the basic probe liquid, formamide, shows the highest spreading and penetration rate (K-value) on wood surfaces.
Type de document: | Article publié dans une revue avec comité d'évaluation |
---|---|
Volume: | 70 |
Numéro: | 5 |
Pages: | p. 711-717 |
Version évaluée par les pairs: | Oui |
Date: | Septembre 2012 |
Sujets: | Sciences naturelles et génie > Génie > Génie des matériaux et génie métallurgique |
Département, module, service et unité de recherche: | Départements et modules > Département des sciences appliquées > Module d'ingénierie |
Mots-clés: | Contact angle, dynamic wetting, heat treatment wood, K-value, liquid, sanding, surface preparation, wood surface, penetration rate, dynamic contact angle, untreated wood |
Déposé le: | 13 mars 2019 23:54 |
---|---|
Dernière modification: | 13 mars 2019 23:54 |
Éditer le document (administrateurs uniquement)